Syenta Raises $26M in Series A Funding Led by Playground Global

The round also saw participation from existing investors Investible, Salus Ventures, Jelix Ventures and Wollemi Capital. The raise brought the total amount to over $36M. As part of the investment, Pat Gelsinger, general partner at Playground Global, will join Syenta’s board of directors.

The company plans to use the funds to accelerate the commercialization of its technology and expand into the United States as it prepares for large-scale production.

Syenta’s proprietary Localized Electrochemical Manufacturing (LEM) technology improves AI system performance and availability by enabling high-density, chip-to-chip connections. Early results show micron-scale interconnects with higher bandwidth and greater manufacturing efficiency, reducing process steps by 40% without redesigning existing manufacturing infrastructure.

By using more scalable manufacturing methods LEM makes advanced packaging more accessible, and helps reduce wafer supply chain constraints. The process has been validated through industry programs including collaborations with leading semiconductor equipment providers.

As AI systems grow beyond the limits of traditional chip design, their performance is increasingly constrained by the efficiency of chip interconnects and communication, especially in advanced packaging. This challenge is becoming more serious as demand for AI and high-performance systems rises, while advanced packaging capacity is still limited to a few specialized facilities, making it harder to scale these systems.

This investment brings together partners from the United States and Australia to speed up the rollout of Syenta’s technology. As the company moves toward commercialization, it is establishing a presence in Arizona to be closer to key semiconductor customers and advanced packaging efforts, enabling better collaboration with partners while supporting the growth of the U.S. semiconductor industry and a stronger supply chain.

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“AI is driving unprecedented demand for heterogeneous, panel-scale systems. These systems—often composed of hundreds of chiplets—require continued innovation in packaging architectures to increase interconnect bandwidth while improving energy efficiency,” said Deepak Kulkarni, senior fellow, AMD.

“Today’s advanced packaging approaches have real limits on interconnect density, which constrain the bandwidth between chips,” said Dr. Jekaterina Viktorova, CEO and founder of Syenta. “We’re enabling finer-pitch connections within existing manufacturing infrastructure, allowing systems to move more data more efficiently and at a lower cost without requiring entirely new fabrication approaches.”

“This is a new way of building high-performance systems at unprecedented scale and power, particularly as AI workloads continue to grow,” said Pat Gelsinger, general partner at Playground Global. “AI’s next scaling challenge isn’t just compute, it’s how chips connect. What’s compelling about Syenta is that the company is tackling a key constraint in advanced packaging and contributing to the expansion of a more resilient global semiconductor ecosystem.”

“Syenta shows the kind of strong, globally competitive innovation the NRF was set up to support,” said Dr. Mary Manning, Chief Investment Officer at NRF. “By developing next generation packaging technologies, Syenta helps strengthen Australia’s role in key supply chains and supports the resilience of the global semiconductor industry.”

About Syenta

Founded in 2022, by Dr. Jekaterina Viktorova (CEO), Ben Wilkinson (CTO), Prof. Luke Connal, and Zachary Dowse (COO), Syenta is a semiconductor company focused on improving AI computing through advanced chip packaging technology. Based on research from the Australian National University, a new way to connect chips has been developed that boosts performance and scalability. Headquartered in Australia, Syenta operates globally with teams in Australia, Europe and the United States.

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