Multibeam Corp. today announced that it has raised $31 million in Series B funds from global investors led by Onto Innovation Inc. (NYSE: ONTO), a leader in process control solutions for advanced nodes and advanced packaging, and Lam Capital, the venture capital arm of Lam Research Corp. (NASDAQ: LRCX), a global provider of wafer fabrication equipment and services for the semiconductor industry. Participants also include UMC Capital, the venture capital arm of UMC Corp. (NYSE: UMC), and MediaTek Capital, the venture capital arm of MediaTek Inc. (TWSE: 2454.TW). Several leading financial and corporate investors also contributed to the oversubscribed round, alongside existing investors.
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Multibeam will use the proceeds to accelerate development of its next-generation multi-column E-Beam Lithography (EBL) platform for 300mm wafer and panel-level maskless lithography. The funds will also be used to develop applications that enable silicon innovations to meet the lower-energy and higher-performance demands of artificial intelligence (AI) and related technologies, which require advanced packaging and integration of semiconductors, as well as rapid development and time-to-market of new chip technologies and designs. Multibeam’s platform offers a powerful, production-grade tool that provides full-wafer (or panel-level) field of view, exceptional depth of focus (DoF), maskless writing, and the ability to write unique patterns. These capabilities will unleash new frontiers in chip design for quantum computing, photonics, MEMS, compound semiconductors and power devices.
The investors in this round exemplify the support that Multibeam has drawn from leaders throughout the silicon ecosystem, building upon its existing partnerships with companies such as EDA leader Synopsys. The funding marks the next phase of growth for the EBL leader.
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