Tessolve, a global provider of silicon and systems solutions for next-generation products has announced a strategic collaboration with SigmaSense to develop its innovative DSP-based sensing ASIC.
The state-of-the-art software-defined sensing technology from SigmaSense will be seamlessly merged with a state-of-the-art, low-power touch-sense controller chip in this sophisticated mixed signal ASIC.
The chip’s revolutionary performance in terms of sensitivity, refresh rates, and signal-to-noise redefines touch and touchless interaction. It solves the problems of high capacitive loads and thinner displays, allowing accurate and continuous high-impedance sensing for a smooth user experience.
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Offering SigmaSense clients unmatched sensitivity and ultra-low power consumption even in harsh environmental conditions, it boasts a broad range of applications spanning the automotive, gaming, consumer electronics, and computing sectors. It also has a unique digital signal processing system that improves programmability for the best possible user experience.
Srini Chinamilli, Co-founder & CEO, Tessolve said, “Capitalizing on our expertise in pre-silicon design and post-silicon test, we developed the touch sense control solution, facilitating a smooth progression through the entire development process. This comprehensive approach effectively addresses the hurdles of conventional methods, resulting in faster time-to-market and enhanced quality for next-generation chip design, At Tessolve, we specialize in design and engineering services, with a focus on the seamless integration of various intellectual properties (IPs) into SOCs. Our primary focus behind this initiative was to prioritize stringent power demands through the integration of SigmaSense’s Analog IP and DSP IP into a powerful sensing SOC tailored for 40nm specifications,”.
Tessolve has developed its inventive product designs by utilising the cutting-edge sensing technology of SigmaSense. Its first-pass silicon was successful because of the quick deployment of its IC Design and Methodology teams from RTL to GDS, which allowed them to combine the ground-breaking Analogue and Mixed Signal technologies.
By offering complete ASIC services, including as digital and analogue design, post-silicon bring-up, and validation, Tessolve shortens time-to-market. Tessolve implemented a hybrid employment approach, combining onsite engineering in Austin with a bigger workforce based in Bengaluru, to optimise cost and time. Tessolve accelerated ATE Test Development for a quicker ramp to production for the SDC300 by utilising their test facility in Austin.
Dave French, CEO, SigmaSense said, “Collaborating with Tessolve aligns with our vision of revolutionizing touch and sensing technology. Their expertise in silicon design and systems solutions was instrumental in bringing our innovative sensing ASIC to life, Our software-defined sensing technology brings superior sensitivity, low power consumption, and high performance to the product, across various applications. We are confident that this advanced microcontroller will have a significant impact in transforming user experiences in various sectors.”
About Tessolve
Tessolve provides complete turnkey silicon and system solutions, from design to packaged parts, by combining a special blend of pre- and post-silicon knowledge. With comprehensive hardware and software capabilities as well as sophisticated silicon and system testing labs, Tessolve offers a one-stop shop solution.
About SigmaSense
A much improved DSP-based sensing technique is being pioneered by SigmaSense. Software-defined sensing technology from the company offers previously unthinkable breakthrough levels of speed, accuracy, resolution, and noise immunity. More than 300 granted or authorised patents and more than 150 pending patents spanning 35 application families safeguard this novel strategy.
