SUMMARY
- Eliyan has raised $145 million in Series C funding led by Seligman Ventures, reaching a $1 billion valuation.
- Eliyan develops connectivity technologies for AI, cloud, and high-performance computing systems, including chiplet and interconnect solutions.
- The company will use the funding to accelerate AI infrastructure technology, expand strategic partnerships, and increase its manufacturing capacity.
Eliyan Corporation, a Santa Clara, CA-based developer of foundational connectivity technologies enabling next-generation AI compute, memory, and networking systems, has raised $145 million Series C funding round led by Seligman Ventures at a $1 billion valuation.
The round also saw participation from additional new and existing investors, including Cisco Investments and Lumentum. As part of the financing, veteran technology investor and operator Umesh Padval, Managing Partner of Seligman Ventures, will join Eliyan’s Board of Directors.
The company plans to use this funding to accelerate the development of its AI infrastructure connectivity technologies, expand strategic partnerships, and scale manufacturing capabilities for next generation AI compute, memory, and networking systems.
Funding Snapshot
| Metric | Details |
|---|---|
| Fundraise Amount | $145 Million |
| Valuation | $1 Billion |
| Company | Eliyan Corporation |
| Sector | Semiconductor & AI Infrastructure |
| Headquarters | Santa Clara, California, USA |
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About Eliyan Corporation
Founded in 2021 by Ramin Farjadrad, Syrus Ziai, Patrick Soheili, Eliyan Corporation develops foundational connectivity technologies that power next generation AI, cloud computing, and high performance computing systems. Its products are designed to address critical challenges related to bandwidth, memory expansion, scalability and power consumption in modern AI infrastructure.
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The company's silicon-proven NuLink PHYs and NuGear chiplet solutions enable efficient communication across compute, memory, and electro-optical domains. Eliyan is also expanding into optical interconnect technologies to support the industry's transition towards increasingly complex, and bandwidth intensive AI compute architectures.
Core offerings include:
- AI infrastructure connectivity technologies.
- Chiplet and interconnect solutions.
- Memory expansion technologies.
- Optical and electrical connectivity platforms.
Core Technologies / Products / Services
| Capability/Product | Application/Use Case |
|---|---|
| NuLink™ PHYs | High-speed AI infrastructure connectivity |
| NuGear™ Chiplets | Scalable chiplet-based compute systems |
| Optical Interconnect Technologies | High-bandwidth AI networking |
| Memory Expansion Solutions | Enhanced AI compute performance |
Leadership Comments
"AI infrastructure is undergoing one of the largest architectural transitions in computing history," said Ramin Farjadrad, CEO and Co-Founder of Eliyan. "As compute, memory, packaging, and networking become increasingly interconnected, traditional approaches to system connectivity are reaching their limits. Eliyan was founded to address these challenges at the architectural level.
“We are thrilled to partner with repeat founders Ramin, Patrick, and Syrus as they build a leader in high-speed interconnect technology for AI infrastructure,” said Umesh Padval, Managing Partner at Seligman Ventures. “As AI systems continue to scale, efficient electrical and optical interconnects that enable future scale-up and scale-out networks between compute and memory are becoming the performance-defining technologies of modern AI data centers.
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