TYLsemi Raises $43M in Funding Led by Matter Venture Partners

The round also saw participation from Viola Ventures, GHOVC, Egis Technology, and others.

The company will use the funding to expand its operations and accelerate product development.

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TYLsemi is the first chiplet platform company to offer a complete portfolio covering I/O, power delivery, memory, and custom chiplet-based silicon design. The company also manages chip integration and the supply chain, giving customers a complete solution in one place.

Its production-ready, standards-based platform helps AI infrastructure companies develop custom AI chips faster, reduce development risks, and move more quickly from design to deployment.

AI chips are moving away from single, large processors to smaller chiplets because traditional chip designs are reaching their physical limits. At the same time, better packaging technology now allows multiple chiplets to work together as one system.

With industry standards like UCIe making chiplets easier to connect, chiplet-based designs have become a practical and scalable way to build more powerful AI hardware.

TYLsemi offers a production-ready portfolio of reusable chiplets that makes it easier for companies to build advanced multi-chip AI systems. Customers can use these chiplets on their own or as the foundation for custom AI chips built using leading semiconductor manufacturing and packaging technologies.

"AI infrastructure is entering an era of rapid scaling, so the ability to develop advanced silicon quickly and efficiently will be a defining advantage," said Wen Hsieh, Founding Managing Partner at Matter Venture Partners. "TYLsemi is building foundational chiplet technologies for custom silicon that will make the design process faster, less risky, and more accessible, unlocking significant value and velocity across the AI ecosystem."

"TYLsemi has built the chiplet platform the entire AI silicon industry needs — one that can serve the scale of a hyperscaler and the speed requirements of an emerging AI company in the same breath," said Zvika Orron, Managing Partner at Viola Ventures. "For the first time, advanced custom silicon development isn't a competitive moat reserved for the largest players; it's a platform."

"The AI accelerator market is on track to reach $604 billion by 2033 and custom silicon XPUs built for specific hyperscaler workloads are the fastest-growing segment," said Mohit Gupta, Founder and CEO of TYLsemi. "At that scale, chiplet-based design is no longer optional, yet there is no pure-play chiplet company serving this market with a full portfolio.

About TYLsemi

Founded in 2026 by Mohit Gupta and Sunil Bhardwaj, TYLsemi develops production ready chiplets for next generation AI infrastructure. The company provides standards based chiplet's that help customers build advanced multi chip AI systems faster and with lower risk. Its chiplets can be used as standalone components or as the foundation for custom AI chips, supported by the company's expertise in chip design packaging, integration and manufacturing.

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