OpenLight Raises $50M in Series A-1 Funding

The company plans to use the funds to speed up development of its III-V integration platform, including advanced 400G modulators, on-chip lasers, and optical amplifier technology.

OpenLight offers a process design kit (PDK) that combines indium phosphide with silicon photonics. It includes a full set of components like lasers, modulators, amplifiers, and detectors. Tested at Tower Semiconductor, the PDK helps customers create designs that are ready for production from the start.

Using these proven components, customers can build custom PASICs more easily and bring products to market faster. Today, over 25 companies use OpenLight’s PDK to design and produce PASICs for different applications. The company also holds more than 410 patents related to its PDK and III-V photonics manufacturing technology.

“We at Matter Venture Partners are excited to lead this OpenLight investment round. Optical technology is critical to the future scaling of data centers and AI infrastructure. We believe OpenLight’s heterogeneous integrated silicon photonics platform will be the core ingredient to this worldwide global expansion of optical connectivity where power and bandwidth matter,” said Wen Hsieh, Founding Managing Partner at Matter Venture Partners.

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“We are excited to have Wen Hsieh and the Matter Venture Partners team as part of OpenLight investors. Their connection to the semiconductor ecosystem will be a key asset as we scale our technology and customer base. The strong interest from leaders across the semiconductor industry underscores the momentum behind OpenLight’s technology and vision,” said Adam Carter, President and CEO of OpenLight. “This oversubscribed funding round adds highly sophisticated investor partners who will enable us to accelerate our strategic roadmap, expand worldwide sales and technical support, and bring heterogeneous photonic integrated circuits to global markets at scale.”

About OpenLight

Founded in 2022, OpenLight develops PASiC technology that combines all active, and passive photonics components into a single chip. Supported by it's process design kit, this approach enables high performance energy efficient solutions across industries such as data communications, telecom, automotive AI and quantum computing.

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